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Fielco is pioneering the development of several new
technologies that may be exactly what you are looking
for.
One-Part Epoxy Adhesives:
Competitive pressures have driven manufacturing companies
to improve productivity, increase product quality and to
decrease hazards to the workforce. These
factors have created an opportunity for Fielco Adhesives
to deliver a value added one-part replacement for many
conventional two-part systems.
» Learn More About The Benefits
Of One-Part Epoxy Adhesives
BondAway:
We are proud to introduce our exciting new line of BondAway
epoxy adhesives. These innovative products combine
the properties associated with epoxy adhesives but
with the remarkable ability to easily de-bond! BondAway
temporary bonding epoxy adhesives are an engineer’s
dream.
» Learn More
About BondAway
Ultra-Violet Light Cure:
In applications where performance and assembly efficiency are critical, such
as high-speed laminating, UV has been especially effective and desirable.
There have been exciting recent developments in this technology, including deeper
UV cure penetration with applications to pigmented surfaces (which previously
had limited the uses of UV cure, due to the limits of light depth), and less
expensive cure systems.
» Learn
More About Ultra-Violet Light Cure
» Learn
More About Dual Core Technology
Electronics Encapsulation Materials:
Typically used to protect delicate assemblies from shock and severe climate conditions,
the demands on these formulations have increased with emphasis on severe
climate conditions of electronics equipment, and product miniaturization.
For years we have been continually improving encapsulation formulations, to insure
they meet and exceed the new industry requirements.
» Learn
More About Electronics Encapsulation Materials |
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