ELECTRONIC
ENCAPSULATE SELECTOR GUIDE
TO
RETURN TO THE PRODUCT SELECTOR MENU, CLOSE THIS WINDOW (ALT + F4)
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Product
Description
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ASTM
D-1084
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Mix
Ratio
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Color
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ASTM D-2471 |
ASTM
D-2240
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ASTM
D-149
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ASTM
D-150
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ASTM
D-257
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Viscosity
A (cps)
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Viscosity
B (cps)
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By
Volume
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By
Weight
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Gel
time 50 gr. Mass (77ºF, minutes)
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Hardness
Shore D
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Dielectric
Strength (Volts/Mil)
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Dielectric
Constant (100Hz)
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Dissipation
Factor (100Hz)
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Volume
Resistivity (Ohm-cm)
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ODYSSEY |
Odyssey 174 Tough, two part, epoxy encapsulate and transducer mounting adhesive. |
9,000
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25
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100:39
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100:16
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Black
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50
|
80
|
450
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4.2
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0.0300
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3.6
x 1015
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| Odyssey 1220 General purpose, ambient curing, two part epoxy potting compound for various electrical applications. |
35,000
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20
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100:33
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100:10
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White
|
100
|
80
|
400
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4.4
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0.0200
|
4.0 x 1015 | |
| Odyssey 3125 Epoxy potting compound with excellent humidity, impact and abrasion resistance with service temperatures of 300°F. |
12,500
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700
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100:44
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100:35
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Red
|
90
|
80
|
500
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4.0
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0.0028
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4.5
x 1014
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| Odyssey 6800 Heat curing, fast setting, one part epoxy adhesive designed for bonding applications requiring heat dissipation. |
Viscous
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N/A
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N/A
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N/A
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Gray
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2*
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95
|
500
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3.0
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0.0050
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8.1x
1015
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| Odyssey 6835 Semi-flexible, heat curing anhydride based potting compound for Class B electrical applications with excellent thermal shock and moisture resistance. |
12,500
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110,000
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25:100
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17:100
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Red
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20**
|
55
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325
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5.9
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0.0600
|
4.0
x 1015
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| Odyssey 6840 Tough, heat curing anhydride based potting compound with excellent electrical properties and adhesion to metal coils and enclosures. |
10,000
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90,000
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18:100
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17:100
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White
|
26**
|
70
|
320
|
6.1
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0.0600
|
4.0
x 1015
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| Odyssey 6850 Ambient curing potting compound which allows for complete impregnation of small coils and components. |
25,000
|
550
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100:41
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100:25
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Black
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40
|
70
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450
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3.2
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0.0250
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4.0
x 1015
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| Odyssey 6860 Rapid setting, ambient curing epoxy potting compound for encapsulation of small circuit assemblies. |
10,000
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3,000
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100:26
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100:20
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Yellow
|
7
|
85
|
400
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4.0
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0.0300
|
4.5
x 1014
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| Odyssey 6870 Impact resistant, fast setting electronic potting compound well suited for high humidity environments. |
1,000
|
10
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100:36
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100:30
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Amber
|
400
|
85
|
550
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4.7
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0.0030
|
5.0
x 1015
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| Odyssey 13915 Fast setting, ambient curing epoxy potting compound for encapsulation of small circuit assemblies. |
13,000
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4,500
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100:26
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100:18
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Yellow
|
15
|
85
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400
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4.2
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0.0300
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4.8
x 1014
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| Odyssey 14146 Semi-flexible, heat curing anhydride based electronic potting compound for Class B electrical applications with excellent thermal shock and impact resistance. |
1,000
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2,000
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100:100
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100:90
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Black
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25**
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60
|
325
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5.9
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0.0600
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4.5
x 1014
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REGENCY |
Regency 7209 Flexible, low viscosity, self leveling urethane encapsulate suited for rigorous environments. |
50
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5,000
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22:100
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18.5:100
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White
|
25
|
30
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450
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4.3
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0.0200
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3.0
x 1013
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| Regency 7309 Resilient, thixotropic, low shrinkage urethane encapsulate with excellent electrical and mechanical properties. |
1,500
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25,000
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31:100
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25:100
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White
|
35
|
30
|
450
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4.4
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0.0200
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3.8
x 1013
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| Regency 7409 Unfilled, resilient urethane encapsulate with zero embedded stress having excellent moisture barrier properties designed for potting delicate components. |
77
|
4,800
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100:100
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100:93
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Amber
|
80
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20
|
450
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4.0
|
0.0300
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1.8
x 1015
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