Fielco Adhesives takes great pride in supplying the
highest quality, most consistent, and user friendly adhesives.
Fielco’s products are easily customized for specific
application requirements. Key properties such as viscosity,
mix ratio, and reactivity of each adhesive are commonly
fine-tuned by Fielco’s formulation chemists to
meet the specific needs of each customer.
Fielco’s materials research laboratory is equipped
with state-of-the-art analytical and testing equipment.
These resources are used to develop adhesives for the
most demanding applications, while insuring product quality
and consistency.
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Our Chief Adhesive Scientist
Fielco Laboratory Capabilities
DSC - Differential Scanning Calorimeter - Thermal
Analyst 2000 System
Measurements:
| Glass Transitions |
Melting Points |
Crystallization Time |
Crystallization Temperature |
Percent Crystallinity |
Heats of Fusion and
Reaction |
Specific Heats |
Oxidative Stability |
Rate of Cure |
Degree of Cure |
Reaction Kinetics |
Purity |
Thermal Stability |
Boiling Points |
| Cure Exotherm |
Peak Exotherm Temperature |
| Reaction Onset Temperature |
|
DEA - Dielectric Analysis
Measurements:
| Transition Temperatures |
Dielectric Properties |
a) Permittivity |
b) Loss
Factor |
Flow Characteristics
via Ionic Conduction |
Molecular Relaxation
Studies |
Simultaneously
Scans up to 28 Frequencies |
Quality Factor |
|
Rate and Degree
of Cure |
Inductance |
Impedance Magnitude |
Volume and Surface
Resistance |
Capacitance |
Conductance |
Dissipation Factor |
|
Mechanical
Analysis Testing: Sintech Mechanical
Analyzer
Measurements:
| Tensile Strength |
Tensile Modulus |
Tensile Elongation |
Flexural Strength |
Flexural Modulus |
Flexural Elongation |
Compression Yield Strength |
Lap Shear Strength |
Ultimate Compressive
Strength |
Fracture Toughness |
Short Beam Shear Strength |
Adhesive Testing - All
Modes |
Standard Laboratory Tests
Measurements:
| Titration - End
Group Analysis (Epoxy, Urethane, etc.) |
Infrared Spectroscopy |
Brookfield Viscosity
& Thixotropy
-40° -400°C |
Brookfield Cone
Plate Rheometry
-40° -100°C |
Density |
Hardness |
Chemical and
Solvent Resistance |
Gel Time - Room
Temperature |
Elevated Temperature
Stroke Gel Time |
|
Temperature & Humidity
Aging (5° - 120°C, 5 - 100%RH) |
Percent Solids |
Electrical Property
Testing |
Gloss Measurements |
Thermal Cycling |
UV Analysis |
UV Cure Analysis |
Karl Fisher Water
Titration |
|
|
