Fielco is pioneering the development of several new technologies that maybe exactly what you are looking for...

One of the most exciting developments in adhesive technology is the use of UV-Ultra-violet light cure.

In applications where performance and assembly efficiency are critical, such as high-end electronics, UV has been especially effective and desirable.

There have been exciting recent developments in this technology, including photoinitiatorless chemistry, deeper UV cure penetration with applications to pigmented surfaces (which previously had limited the uses of UV cure, due to the limits of light depth), and less expensive cure systems. To find out more about UV and if it would be the "right" technology for your specific application contact us by e-mail.

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Another new process that is proving very beneficial is "Dual Cure" technology. Dual Cure involves the use of two-different technologies, such as UV for an initial cure and conventional adhesives technology for the final cure. The first cure stage provides the green strength (holding, but not fully cured) that's often necessary for the assembly process. This can be especially helpful in electronics assembly, where you would need a fast cure for the assembly line, and then the product could cure fully over time. To find out more about Dual Cure technology contact us by e-mail.

Electronics encapsulation materials. Typically used to protect delicate assemblies from shock and severe climate conditions, the demands on these formulations have increased with increased emphasis on severe climate conditions of electronics equipment, and product miniaturization.

For years we have been continually improving encapsulation formulations, to insure they meet and exceed the new industry requirements.

Fielco has a product selector guide section on encapsulation materials. And we also conduct ongoing research into the frontiers of encapsulation technology. To find out more about encapsulation materials, contact us by e-mail.